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99 95 Mo2 targets

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China 99.99% and 99.95%Tantalum Targets Seller with RO5200

China 99.99% and 99.95%Tantalum Targets Seller with RO5200

Item Name:Ta Sputtering Target Purity:99.9% Shape:Circular, Rectangular Available size: Round: dia 20~250mm Rectangular: length up to 1600mm Customization is available Oxygen content:low Certificates:ISO9001:2008, the third test report Technics:Powder Metallurgy Application:a: architectural...

China 99.95% Mo1 Targets with Bright Surface and Thickness Tolerance for Seller

China 99.95% Mo1 Targets with Bright Surface and Thickness Tolerance for Seller

Name:Mo1 targets Model Number:Mo1 Size:2.0-60mm*20-500mm*20-1000mm Application:industrial/electronic, high temperature Dimensions:As customer requirements Chemical Composition:Mo>=99.95% Type:high quality molybdenum plate Density:10.2g/cm3 Melting point:2610 Surface:polishing,Black,Sintering...

China 99.95% Mo2 Targets with Bright Surface and Thickness Tolerance for Seller

China 99.95% Mo2 Targets with Bright Surface and Thickness Tolerance for Seller

Product Name:tungsten/molybdenum disk Grade:Mo2 Surface Treatment:Polished, Forged, Straightening Purity:≥99.95% Density:≥18.6g/cm3 Standard:GB4188-84, GB/T4187-2006 or customer’s request Test and Quality:1.ISO 9001 2.Mechanical properties test 3.Inspection according to industry and customer...

China 99.99% and 99.95%Tantalum Targets Seller with RO5400

China 99.99% and 99.95%Tantalum Targets Seller with RO5400

Condition:Annealed Standard:ASTMB708 Item Name:Ta Sputtering Target Purity:99.9% Material:Ta-2.5W, Ta-10W, Ta-40Nb Shape:Circular, Rectangular Available size: Round: dia 20~250mm Rectangular: length up to 1600mm Customization is available Oxygen content:low Certificates:ISO9001:2008, the third...

99.95% Pure Tungsten Targets with W1 ASTM B760

99.95% Pure Tungsten Targets with W1 ASTM B760

Tungsten titanium alloy sputtering target can be used to make the diffusion barrier for semiconductor chips, the new solar cell and the ceramic thin film circuit. Tungsten silicon alloy sputtering target can be used for the ohmic contact layer of the semiconductor chips.

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