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99.95% Pure Tungsten Targets with W1 ASTM B760

99.95% Pure Tungsten Targets with W1 ASTM B760

Tungsten titanium alloy sputtering target can be used to make the diffusion barrier for semiconductor chips, the new solar cell and the ceramic thin film circuit. Tungsten silicon alloy sputtering target can be used for the ohmic contact layer of the semiconductor chips.

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99.95% Pure Tungsten Targets With W1 ASTM B760

Tungsten titanium alloy sputtering target can be used to make the diffusion barrier for semiconductor chips, the new solar cell and the ceramic thin film circuit.

Tungsten silicon alloy sputtering target can be used for the ohmic contact layer of the semiconductor chips.

Type

W(wt%)

Ti(wt%)

Si(wt%)

Purity(wt%)

Density(%)

Grain Size& (μm)

Dimension (max.mm)

Ra

WTi10

90±0.5

10±0.5

/

99.9-99.999

≥99

﹤10

?400×40

≤1.6

WTi20

80±0.5

20±0.5

/

99.9-99.995

≥99

﹤10

?400×40

≤1.6

WSi10

90±0.5

/

10±0.5

99.9-99.999

≥99

﹤10

?400×40

≤1.6

WSi20

80±0.5

/

20±0.5

99.9-99.999

≥99

﹤10

?400×40

≤1.6


If you are looking for 99.95% pure tungsten targets with w1 astm b760, welcome buy the quality and durable Tungsten And Tungsten Alloy Targets for sale from us. We are one of the leading aluminum products manufacturers and suppliers in China. We'll offer you competitive price and excellent service.

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